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HiBond 70-1 Chip Bonding Adhesive

HiBond 70-1 Chip Bonding Adhesive
products.sku: HiBond 70-1
products.manufacturer: Cardel
products.tags

Cardel has developed a unique range of film adhesives specifically designed for embedding chips in smartcards. These adhesives are globally used in the production of over 4 billion smart cards each year – including banking / EMV, ID cards and telco / SIM.

The adhesives offer a high degree of flexibility, security and precision, and are suitable for PVC, ABS composite and Polycarbonate cards and have been developed for use with full range of module types (FR4, FCOS). The adhesives are compatible with all major production machines.

Cardel’s Hi Bond is rigorously tested against ISO and CQM standards. It offers a long shelf-life (2 years+) with no need for special storage conditions (e.g. refrigeration).

Cardel has developed a unique range of film adhesives specifically designed for embedding chips in smartcards. These adhesives are globally used in the production of over 4 billion smart cards each year – including banking / EMV, ID cards and telco / SIM.

The adhesives offer a high degree of flexibility, security and precision, and are suitable for PVC, ABS composite and Polycarbonate cards and have been developed for use with full range of module types (FR4, FCOS). The adhesives are compatible with all major production machines.

Cardel’s Hi Bond is rigorously tested against ISO and CQM standards. It offers a long shelf-life (2 years+) with no need for special storage conditions (e.g. refrigeration).