Cardel Cardlam 200 Lamination Pads
Cardel Cardlam 220 Lamination Pads offer increased productivity and quality in all types of plastic card lamination, including SmartCards.
The Cardlam 220+ WS is a high efficiency, conductive silicon lamination pad with a reinforced center core designed for use in single and twin stack laminators. The Cardlam 220+ WS is fully compatible with all tilt tray assembly systems, and is ideally suited for bank and smart card production.
Metallic woven, high temperature lamination pad. Rapid heat transfer - generally recommended for single stack laminators.
HiBond 3 Chip Bonding Adhesive
HiBond 70-1 Chip Bonding Adhesive
